Features
? Single 2.7V - 3.6V Supply
? Serial Peripheral Interface (SPI) Compatible
– Supports SPI Modes 0 and 3
? 70 MHz Maximum Clock Frequency
? Flexible, Uniform Erase Architecture
– 4-Kbyte Blocks
– 32-Kbyte Blocks
– 64-Kbyte Blocks
– Full Chip Erase
32-megabit
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Individual Sector Protection with Global Protect/Unprotect Feature
– Sixty-Four 64-Kbyte Physical Sectors
Hardware Controlled Locking of Protected Sectors
Flexible Programming
– Byte/Page Program (1 to 256 Bytes)
Automatic Checking and Reporting of Erase/Program Failures
JEDEC Standard Manufacturer and Device ID Read Methodology
Low Power Dissipation
– 7 mA Active Read Current (Typical)
– 15 μA Deep Power-Down Current (Typical)
Endurance: 100,000 Program/Erase Cycles
Data Retention: 20 Years
Complies with Full Industrial Temperature Range
Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options
– 8-lead SOIC (200-mil wide)
2.7-volt
Minimum
SPI Serial Flash
Memory
AT25DF321
For New
– 16-lead SOIC (300-mil wide)
1. Description
Designs Use
AT25DF321A
The AT25DF321 is a serial interface Flash memory device designed for use in a wide
variety of high-volume consumer based applications in which program code is shad-
owed from Flash memory into embedded or external RAM for execution. The flexible
erase architecture of the AT25DF321, with its erase granularity as small as 4-Kbytes,
makes it ideal for data storage as well, eliminating the need for additional data storage
EEPROM devices.
The physical sectoring and the erase block sizes of the AT25DF321 have been opti-
mized to meet the needs of today's code and data storage applications. By optimizing
the size of the physical sectors and erase blocks, the memory space can be used
much more efficiently. Because certain code modules and data storage segments
must reside by themselves in their own protected sectors, the wasted and unused
memory space that occurs with large sectored and large block erase Flash memory
devices can be greatly reduced. This increased memory space efficiency allows addi-
tional code routines and data storage segments to be added while still maintaining the
same overall device density.
3669B–DFLASH–6/09
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相关代理商/技术参数
AT25DF512C-MAHNGU-T 功能描述:IC FLASH 512KB 8UDFN 制造商:adesto technologies 系列:- 包装:带卷(TR) 零件状态:有效 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:512K(64K x 8) 速度:85MHz 接口:SPI 串行 电压 - 电源:1.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C(TC) 封装/外壳:8-UFDFN 裸露焊盘 供应商器件封装:8-UDFN(2x3) 标准包装:5,000
AT25DF512C-MAHNGU-Y 功能描述:IC FLASH 512KB 8UDFN 制造商:adesto technologies 系列:- 包装:托盘 零件状态:停产 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:512K(64K x 8) 速度:85MHz 接口:SPI 串行 电压 - 电源:1.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C(TC) 封装/外壳:8-UFDFN 裸露焊盘 供应商器件封装:8-UDFN(2x3) 标准包装:490
AT25DF512C-MAHN-T 功能描述:IC FLASH 512KB 8UDFN 制造商:adesto technologies 系列:- 包装:剪切带(CT) 零件状态:有效 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:512K(64K x 8) 速度:85MHz 接口:SPI 串行 电压 - 电源:1.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C(TC) 封装/外壳:8-UFDFN 裸露焊盘 供应商器件封装:8-UDFN(2x3) 标准包装:1
AT25DF512C-MAHN-Y 功能描述:IC FLASH 512KB 8UDFN 制造商:adesto technologies 系列:- 包装:托盘 零件状态:停产 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:512K(64K x 8) 速度:85MHz 接口:SPI 串行 电压 - 电源:1.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C(TC) 封装/外壳:8-UFDFN 裸露焊盘 供应商器件封装:8-UDFN(2x3) 标准包装:490
AT25DF512C-SSHN-B 功能描述:IC FLASH 512KB 8SOIC 制造商:adesto technologies 系列:- 包装:管件 零件状态:有效 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:512K(64K x 8) 速度:85MHz 接口:SPI 串行 电压 - 电源:1.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C(TC) 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商器件封装:8-SOIC 标准包装:98
AT25DF512C-SSHNGU-B 功能描述:IC FLASH 512KB 8SOIC 制造商:adesto technologies 系列:- 包装:管件 零件状态:有效 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:512K(64K x 8) 速度:85MHz 接口:SPI 串行 电压 - 电源:1.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C(TC) 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商器件封装:8-SOIC 标准包装:98
AT25DF512C-SSHNGU-T 功能描述:IC FLASH 512KB 8SOIC 制造商:adesto technologies 系列:- 包装:带卷(TR) 零件状态:有效 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:512K(64K x 8) 速度:85MHz 接口:SPI 串行 电压 - 电源:1.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C(TC) 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商器件封装:8-SOIC 标准包装:4,000
AT25DF512C-SSHN-T 功能描述:IC FLASH 512KB 8SOIC 制造商:adesto technologies 系列:- 包装:剪切带(CT) 零件状态:停产 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:512K(64K x 8) 速度:85MHz 接口:SPI 串行 电压 - 电源:1.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C(TC) 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商器件封装:8-SOIC 标准包装:1